SSMIE 2024 Working Group:
Paper will be accepted by email:
Welcome to SSMIE 2024! We are delighted to invite you to participate in 2024 International Conference on Smart System, Mechatronics and Information Engineering (SSMIE 2024) on January 27-28, 2024 in Tianjin, China. The objective of SSMIE 2024 is to provide a forum for researchers, educators, engineers and scientists involved in academia and industry to address profound issues including technical challenges and safety issues, and to present and discuss their ideas, results, work in progress and experience on all aspects of smart system, information technology, mechanical engineering, mechatronics and information engineering.
All accepted papers from SSMIE 2024 will be published by conference proceedings and will submitted to database for indexing. The full text is online available after publication. Prospective authors are kindly invited to submit full text papers including results, tables, figures and references. Full text papers (.pdf or .doc) will be accepted. All submitted articles should report original, previously unpublished research results, experimental or theoretical. Articles submitted to the conference should meet these criteria. Manuscripts should follow the style of the conference and are subject to both review and editing.
The SSMIE 2024 program will include a number of keynote plenary lectures by distinguished scientists in the different areas covered by the main theme of the conference, to provide thematic presentations of their most recent findings. The names of the following keynote speakers and the titles of their presentations have already been confirmed (ordered by date of confirmation):
(1) Asso. Prof. Qijuan Chen, Wuhan University, China
(2) Prof. Zhengxin Hou, Hainan University, China
(3) Prof. Tianlang Lu, Shandong University, China
(4) Prof. Jun Gao, Shandong University, China
(5) Prof. K. S. Keshavrao, Bharati Vidyapeeth College of Engineering, India
(6) Prof. Ghenadii Korotcenkov, Gwangju Institute of Science and Technology, Korea
(7) Dr. Tang Cheefen, Universiti Teknikal Malaysia Melaka, Malaysia